Bernoulli Ceramic End Effector - Kev Tswj Xyuas Wafer Tsis Sib Chwv Rau Cov Wafer Nyias & Fragile
St.Cera's Bernoulli ceramic end effector siv aerodynamic lift los tuav cov wafers yam tsis muaj kev sib cuag. Ua los ntawm cov khoom siv siab-purity 99.8% alumina (Al₂O₃) lossis silicon carbide (SiC), nws muaj cov nozzles precision-machined uas tso cov roj siab los tsim ib daim nyias nyias ntawm qhov kawg effector thiab wafer. Lub hauv paus ntsiab lus tsis sib cuag no tshem tawm cov pa phem sab nraub qaum, ntug chipping, thiab kev puas tsuaj ntawm qhov chaw, ua rau nws zoo tagnrho rau cov wafers nyias (≤100 μm), tawg yooj yim, lossis warped. Lub ceramic substrate muab lub zog flexural siab (361 MPa rau Al₂O₃; txog li 550–600 MPa rau SiC), qhov hnyav tsawg, thiab qhov ruaj khov zoo heev, ua kom ntseeg tau tias rov ua dua qhov chaw hauv cov neeg hlau hloov wafer ceev ceev.
Lus Cim Txog Cov Khoom Siv:Alumina (Al₂O₃) yog cov khoom siv dav tshaj plaws rau cov khoom siv ceramic hauv kev tuav semiconductor wafer vim nws qhov kev sib xyaw ua ke zoo heev ntawm qhov nyuaj, kev rwb thaiv hluav taws xob, kev ruaj khov tshuaj lom neeg, thiab kev siv nyiaj tsim nyog. Silicon carbide (SiC) muaj kev ua tau zoo dua ntawm thermal conductivity, qhov nyuaj dua, thiab kev tiv thaiv kev hnav zoo dua rau cov ntawv thov uas xav tau ntau tshaj plaws. Thaum yttria-stabilized zirconia (ZrO₂) muaj kev tawg siab ntawm chav tsev kub, nws tsis tshua siv hauv daim ntawv thov no vim nws qhov ceev dua thiab cov yam ntxwv sib txawv ntawm kev nthuav dav thermal; nws yuav raug txiav txim siab rau cov xwm txheej tshwj xeeb uas xav tau kev tawg tshwj xeeb. Thov sab laj nrog peb pab neeg kev tshaj lij rau cov lus qhia xaiv cov khoom siv.
Cov Lus Qhia Tshwj Xeeb(raws li 99.8% Al₂O₃):
Vaj tse | Tus nqi (Al₂O₃) | |
| Khoom siv | 99.8% Alumina | |
| Qhov Ceev | 3.93 g/cm³ | |
| Lub zog flexural | 361 MPa | |
| Kev tawg tawv | 3–4 MPa·m¹/² | |
| Vickers Hardness | 16 GPa | |
| Young's Modulus | 380 GPa | |
| Kev Nthuav Dav Kub (25–1000 ° C) | 7.2 × 10⁻⁶/℃ | |
| Kub Tshaj Plaws Ua Haujlwm | 800°C (cua) | |
| Qhov Roughness ntawm qhov chaw (wafer-facing) | Ra ≤0.4 μm |
Txoj Cai Ua Haujlwm:
Cov cua compressed los yog nitrogen (0.2–0.6 MPa) raug xa los ntawm cov channel sab hauv thiab tawm los ntawm cov nozzles precision. Cov cua nrawm nrawm tsim ib cheeb tsam qis-pressure saum toj no qhov kawg effector (Bernoulli effect), tsim lub zog nqa uas txhawb nqa lub wafer ntawm qhov sib txawv ntawm 50–200 μm. Tsis muaj qhov nqus tsev lossis cov ntaub so ntswg kov sab nraub qaum ntawm wafer.
Cov ntawv thov:
- · Kev tuav cov wafer nyias nyias (≤50 μm) tom qab sib tsoo sab nraub qaum
- · Kev thauj mus los ntawm cov wafer uas nkhaus (piv txwv li, tom qab CVD lossis annealing)
- · Kev hloov pauv ntawm lub cell hnub ci thiab LED sapphire substrate
- · Kev siv tshuab hauv chav huv uas tsis tas yuav tsim cov khoom me me
- · Kev tswj hwm vaj huam sib luag iav hauv kev tsim khoom tso saib
Txheej Txheem Tsim Khoom:
Cov khoom siv ceramic sintered los ntawm cov hmoov purity siab → 5-axis CNC machining ntawm cov roj channel thiab cov qhov nozzle (txoj kab uas hla 0.3–1.0 hli, kam rau siab ± 0.01 hli) → lapping nto rau Ra ≤0.4 μm → kev ntxuav ultrasonic → helium xau kuaj (roj channel). Tsis tas yuav muaj txheej - qhov chaw ceramic liab qab yog inert tshuaj thiab tsis-contamination.
Kev Tswj Xyuas Zoo:
- · Kev tshuaj xyuas qhov ntev (CMM) 100% ntawm qhov chaw ntawm lub nozzle, qhov ntev ntawm caj npab, thiab qhov tiaj tiaj
- · Kev ntsuas qhov sib npaug ntawm huab cua: qhov siab poob ≤5% thoob plaws txhua lub nozzles
- · Kev kuaj qhov xau: cov kav roj kaw ntawm 0.6 MPa, tsis muaj qhov siab poob qis tshaj 30 vib nas this
- · Kev tshuaj xyuas pom hauv qab 20 × lub tshuab kuaj mob rau cov kab nrib pleb me me lossis burrs
Aqhov zoo dua li Cov Khoom Siv Sib Txuas Lus Kawg:
- · Tsis muaj kuab paug rau sab nraub qaum ntawm wafer — tsis muaj kev sib cuag nrog lub tshuab
- · Tsis muaj ntug chipping lossis tawg ntawm cov wafers nyias nyias
- · Ua haujlwm nrog cov wafers uas nkhaus (txog li 1 hli bow) nrog qhov sib txawv ruaj khov
- Tshem tawm lub tshuab nqus tsev thiab kev saib xyuas lub chuck uas muaj qhov porous
- · Kev tsim kho ceramic tiv taus kev hnav thiab kev tawm tsam tshuaj lom neeg
Kev Kho Kom Haum:
- · Muaj rau 200 mm, 300 mm, lossis kev cai wafer loj
- · Cov qauv ntawm lub qhov roj: hom ncaj, kaum sab xis, lossis hom vortex
- · Cov ntaub ntawv: alumina (tus qauv) lossis silicon carbide (rau qhov siab tshaj plaws thermal conductivity thiab hnav tsis kam)
- · Qhov ntev ntawm caj npab, qhov flange mounting, thiab qhov chaw nres nkoj roj raws li OEM daim duab kos
Cov Kev Txwv:
Txoj kev siv Bernoulli txoj cai (tsim lub nozzle, qhov sib txawv ntawm huab cua) yog dhau ntawm qhov ntau thiab tsawg ntawm cov ntaub ntawv khoom siv uas tau muab. Cov khoom siv kho tshuab thiab thermal saum toj no ua raws li cov ntaub ntawv muab rau 99.8% Al₂O₃. Tsis muaj kev puas tsuaj ntawm cov khoom siv ceramic nyob rau hauv cov pa roj uas muaj siab raws li cov khoom siv no. Rau cov wafers uas rhiab rau cov pa roj (piv txwv li, MEMS nrog cov qauv tsis yooj yim), qhov siab ntawm cov pa roj thiab lub nozzle tsim yuav tsum tau kho raws li.







